DARPA ERI Summit 2018: New Commercial DoD Partnership Models
DARPA ERI Summit 2018: New Commercial DoD Partnership Models
Mr. Tom Beckley, Senior Vice President & GM of Custom IC & PCB Group, Cadence Design Systems
To view the slides that correspond to this video, please visit http://www.eri-summit.com/agenda.
ERI Overview
On June 1, 2017, DARPA's Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore's Law, ERI draws both on new ("Page 3") and existing ("Foundational") DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore's seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore's ideas, ERI's "Page 3" investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.
More information about DARPA
► https://www.darpa.mil/
Learn more about ERI
► https://www.darpa.mil/work-with-us/electronics-resurgence-initiative
DARPA ERI Summit 2018: New Commercial DoD Partnership Models
Mr. Tom Beckley, Senior Vice President & GM of Custom IC & PCB Group, Cadence Design Systems
To view the slides that correspond to this video, please visit http://www.eri-summit.com/agenda.
ERI Overview
On June 1, 2017, DARPA’s Microsystems Technology Office (MTO) announced its Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. Recognizing challenges to keeping on pace with Moore’s Law, ERI draws both on new (“Page 3”) and existing (“Foundational”) DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Page three of Gordon Moore’s seminal 1965 paper described research areas required to manage the technical and economic challenges we face. In deference to Moore’s ideas, ERI’s “Page 3” investments support research and development in each of these areas: Architectures, Designs, and Materials and Integration. To fully unlock microelectronics innovation and maintain technical superiority for the Department of Defense (DoD), ERI builds on the tradition of other successful government-industry partnerships and aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and DoD.
More information about DARPA
► https://www.darpa.mil/
Learn more about ERI
► https://www.darpa.mil/work-with-us/electronics-resurgence-initiative
